| 摘要 |
Provided are a photosensitive resin composition which is difficult to generate an abrasion mark on a cured product, a dry film composed by applying and drying the corresponding composition, a cured product of the corresponding composition or the corresponding dry film, and a printed wiring board having the corresponding cured product. The photosensitive resin composition comprises (A) a carboxylic group-containing resin, (B) urethane (meth)acrylate with at least 6 functional groups, (C) a photopolymerization initiator, and (D) titanium oxide. The weight average molecular weight of 1,500 to 200,000 of (B) urethane (meth)acrylate with at least 6 functional groups is desirable. |
