Thermal interface for modular immersion cooling of electronic components,申请号GB20160013234-传众专利搜索

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发明名称	Thermal interface for modular immersion cooling of electronic components
摘要
申请公布号	GB201613234(D0)	申请公布日期	2016.09.14
申请号	GB20160013234	申请日期	2016.08.01
申请人	Iceotape Limited	发明人
分类号		主分类号
代理机构		代理人
主权项
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