| 摘要 |
PROBLEM TO BE SOLVED: To provide a metallized ceramic via substrate, which is capable of being manufactured with a simple method and achieving higher definition of a wiring pattern, and a manufacturing method of the metallized ceramic via substrate.SOLUTION: A metallized ceramic via substrate, which is obtained by forming conductive vias in a ceramic sintered body substrate, includes: the conductive vias obtained by densely filling a conductive metal, which contains a metal (A) having a fusion point in a range between 600°C and 1100°C inclusive, a metal (B) having a fusion point higher than that of the metal (A), and an active metal, into through holes of the ceramic sintered body substrate; and a wiring pattern provided for at least one of both surfaces of the ceramic sintered body substrate to have a surface conductive layer made of a conductive metal containing the metal (A), the metal (B), and the active metal, wherein the wiring pattern has a plated layer on a surface of the surface conductive layer and active layers are formed for an interface between the conductive vias and the ceramic sintered body substrate and an interface between the surface conductive layer and the ceramic sintered body substrate. |
