| 摘要 |
An object of the present invention is to provide a chip-type electronic component with high reliability, which is able to suppress and prevent fatal damage to a ceramic body (10) due to cracking even if a substrate with the chip-type electronic component mounted thereon undergoes a deflection. The chip-type electronic component is configured to include: a ceramic body (10) including internal electrodes (3a,3b); resin electrode layers (12a,12b) formed in a region including at least end surfaces of the ceramic body (10), and formed to connect to the internal electrodes (3a,3b) directly or indirectly and connect with the ceramic body (10); and plating metal layers (13a,13b) formed to cover the resin electrode layers (12a,12b), wherein the adhesion strength between the ceramic body (10) and the resin electrode layer (12a,12b) is higher than the adhesion strength between the resin electrode layer (12a,12b) and the plating metal layer (13a,13b). |
