发明名称 真空パッケージ、真空パッケージの製造方法およびセンサ
摘要 PROBLEM TO BE SOLVED: To realize a vacuum package structure which prevents sealing defects and a manufacturing method of the vacuum package structure.SOLUTION: A vacuum package has a vacuum sealed cavity part and includes: a main substrate 1; a sealing cover 2 having the cavity part on the main substrate 1 and covering the main substrate; a through hole 3 provided in a sealing cover 2 and used for exhausting the cavity part; and a plug 4 sealing the through hole 3. The plug 4 is made of a material having a thermal expansion coefficient lower than that of the sealing cover 2. After the through hole 3 is sealed by the plug 4, the plug 4 sealing the through hole 3 is covered by a sealing material 5.
申请公布号 JP5982973(B2) 申请公布日期 2016.08.31
申请号 JP20120089166 申请日期 2012.04.10
申请人 日本電気株式会社 发明人 黒田 由里
分类号 H01L23/02;G01J1/02;H05K5/06 主分类号 H01L23/02
代理机构 代理人
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