| 摘要 |
The present invention provides a film deposition apparatus, which can promote gas vitalization and adjust uniformity within a substrate surface of film deposition. The film deposition apparatus approximately includes: a cylindrical treatment chamber; a rotary table installed inside the corresponding treatment chamber and allowing a substrate to be stacked on the upper surface thereof; a gas nozzle elongated toward the central axis of the rotary table from an inside wall of the treatment chamber, and elongated toward the upper part of the rotation table in a radial direction of the rotary table; and a side wall heater installed to cover at least a portion of the inside wall of the treatment chamber and/or at least a portion of the surroundings of the central axis of the rotary table in the shape of a wall surface. |
