| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for polishing an optical device wafer, which can collectively replace a plurality of cracked fragments of an optical device wafer.SOLUTION: A method for polishing an optical device wafer includes a cracked wafer coping step comprising: an expanding tape sticking step of sticking an expanding tape which has a larger diameter than a diameter of the cracked optical device wafer, on a second face of the optical device wafer; a protective tape peeling step of peeling off a protective tape on a first face of the cracked optical device wafer; an expanding step of expanding the expanding tape, and separating the adjacent cracked fragments of the optical device wafer from each other; and a protective tape resticking step of sticking a protective tape on the first face of the cracked optical device wafer while such a state that the fragments are separated from each other is maintained. |
