| 摘要 |
A photosensitive resin composition containing [A] an alkali-soluble resin obtained by copolymerizing (A1) one or more types selected from a group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, and (A2) an unsaturated compound containing an epoxy group, [B] a quinone diazide compound, and [C] a block isocyanate compound, the photosensitive resin composition being a compound represented by general formula (1), and containing the block isocyanate in an amount which falls within the range of 0.1-10 mass% in relation to the total solid content of the photosensitive resin composition. (In the formula (1), each R independently represents a C1-20 organic group.) |
