| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a hollow package which maintains the airtightness of a hollow part at low costs.SOLUTION: A manufacturing method of a hollow package includes: a cap placement step where a cap is placed on a substrate including a communication hole; a cap absorption step where the cap is absorbed through the communication hole; and a mold formation step where the cap absorbed by the substrate is covered and a mold closely contacting with the substrate is provided. |
