发明名称 回路基板装置、および、電子機器
摘要 A circuit board device includes: a circuit board; an electronic component bonded to a first surface of the circuit board via an electronic component-bonding portion that is disposed over a rectangular region; and a reinforcing member disposed at one of four corners of a rectangular region of a second surface of the circuit board that is at a position corresponding to a position of the rectangular region of the first surface on a side opposite a side on which the rectangular region is present, wherein the reinforcing member includes a stress receiving portion having an outer edge located in a diagonal line direction of the rectangular region of the second surface and a stress dispersing portion extending in such a manner as to have a fan-like shape or a substantially fan-like shape toward the inside in the diagonal line direction with the stress receiving portion.
申请公布号 JP5983228(B2) 申请公布日期 2016.08.31
申请号 JP20120207341 申请日期 2012.09.20
申请人 富士通株式会社 发明人 増山 卓己;江本 哲;岡田 徹;小林 弘
分类号 H05K1/02 主分类号 H05K1/02
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