发明名称 半導体装置および半導体装置の製造方法
摘要 A semiconductor device which provides compactness and enhanced drain withstand voltage. The semiconductor device includes: a gate electrode; a source electrode spaced from the gate electrode; a drain electrode located opposite to the source electrode with respect to the gate electrode in a plan view and spaced from the gate electrode; at least one field plate electrode located between the gate and drain electrodes in a plan view, provided over the semiconductor substrate through an insulating film and spaced from the gate electrode, source electrode and drain electrode; and at least one field plate contact provided in the insulating film, coupling the field plate electrode to the semiconductor substrate. The field plate electrode extends from the field plate contact at least either toward the source electrode or toward the drain electrode in a plan view.
申请公布号 JP5979836(B2) 申请公布日期 2016.08.31
申请号 JP20110196809 申请日期 2011.09.09
申请人 ルネサスエレクトロニクス株式会社 发明人 田中 聖康
分类号 H01L21/338;H01L21/336;H01L29/06;H01L29/41;H01L29/778;H01L29/78;H01L29/812 主分类号 H01L21/338
代理机构 代理人
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