发明名称 重合性化合物
摘要 PROBLEM TO BE SOLVED: To provide a new polymerizable compound capable of solving problems of an AMA-based compound including heat discoloration resistance and hardness; a polymerizable or curable composition comprising the polymerizable compound; a method for polymerizing or curing the compound or composition; and a polymerized or cured product obtained by the polymerizing or curing method.SOLUTION: There are disclosed a polymerizable compound having one or more functional groups represented by formula (1) in the same molecule; a polymerizable or curable composition comprising the polymerizable compound; a polymerizing or curing method for polymerizing or curing the compound or composition; and a polymerized or cured product obtained by the polymerizing or curing method.
申请公布号 JP5977063(B2) 申请公布日期 2016.08.24
申请号 JP20120086358 申请日期 2012.04.05
申请人 株式会社日本触媒 发明人 金子 知正
分类号 C08F20/28;C07C69/734 主分类号 C08F20/28
代理机构 代理人
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