摘要 |
PROBLEM TO BE SOLVED: To provide a new polymerizable compound capable of solving problems of an AMA-based compound including heat discoloration resistance and hardness; a polymerizable or curable composition comprising the polymerizable compound; a method for polymerizing or curing the compound or composition; and a polymerized or cured product obtained by the polymerizing or curing method.SOLUTION: There are disclosed a polymerizable compound having one or more functional groups represented by formula (1) in the same molecule; a polymerizable or curable composition comprising the polymerizable compound; a polymerizing or curing method for polymerizing or curing the compound or composition; and a polymerized or cured product obtained by the polymerizing or curing method. |