| 摘要 |
A semiconductor device comprises a first semiconductor chip; and a second semiconductor chip provided on the first semiconductor chip with having chip-on-chip connection to the first semiconductor chip, wherein when seen from a direction perpendicular to an upper surface of the second semiconductor chip, an outline of the second semiconductor chip is larger than an outline of the first semiconductor chip, a plurality of electrode terminals for the first semiconductor chip are provided on an upper surface of the first semiconductor chip, the plurality of electrode terminals for the first semiconductor chip comprise one or more first covered terminals which are covered with the second semiconductor chip and one or more first uncovered terminals which are not covered with the second semiconductor chip. |
