发明名称 COPPER PARTICLE DISPERSION AND METHOD FOR PRODUCING CONDUCTIVE FILM USING SAME
摘要 A copper particle dispersing solution obtained by dispersing fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, such as benzotriazole, and coarse copper particles having an average particle diameter of 0.3 to 20 µ m in a dispersing medium, such as ethylene glycol, so as to cause the total amount of the fine copper particles and coarse copper particles to be 50 to 90 % by weight and so as to cause the ratio of the weight of the fine copper particles to the weight of the coarse copper particles to be in the range of from 1:9 to 5:5, is applied on a substrate by screen printing or flexographic printing to be preliminary-fired with vacuum drying, and then, fired with light irradiation by irradiating light having a wavelength of 200 to 800 nm at a pulse period of 100 to 3000 µ m and a pulse voltage of 1600 to 3600 V, to form a conductive film on the substrate.
申请公布号 EP3059289(A1) 申请公布日期 2016.08.24
申请号 EP20140860347 申请日期 2014.10.31
申请人 DOWA ELECTRONICS MATERIALS CO., LTD. 发明人 FUJITA, HIDEFUMI;KANEDA, SHUJI;ITOH, DAISUKE
分类号 C09D5/24;B22F1/02;B22F9/24;C09D7/12;H01B1/00;H01B1/22;H01B13/00;H05K1/09;H05K3/12 主分类号 C09D5/24
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