SEMICONDUCTOR DEVICE WITH AN ISOLATION STRUCTURE COUPLED TO A COVER OF THE SEMICONDUCTOR DEVICE

摘要

A system and method for packaging a semiconductor device that includes a structure to reduce electromagnetic coupling are presented. The semiconductor device is formed on a substrate. A cover is affixed to the substrate so as to extend over the semiconductor device. An isolation structure of electrically conductive material is coupled to the cover in between components of the semiconductor device, with the isolation structure being configured to reduce inductive coupling between those components during an operation of the semiconductor device. In one version, the isolation structure includes a first leg extending from a ground connection along a side wall of the cover to a cross member contiguous with a primary cover wall that extends over the semiconductor device between the components to be isolated electromagnetically.

主权项

1. A semiconductor device comprising:
a substrate; a first electrical circuit on the substrate; a second electrical circuit on the substrate; a cover on the substrate, the cover comprising first and second side walls between which a primary wall extends; and an isolation structure comprising a first leg in contact with the first side wall and a first cross member in contact with the primary wall and connected to the first leg, wherein the isolation structure is configured to reduce electromagnetic coupling between the first electrical circuit and the second electrical circuit during an operation of the semiconductor device.