发明名称 |
MODIFIED TUNGSTEN SILICON |
摘要 |
A method for forming a precision resistor or an e-fuse structure where tungsten silicon is used. The tungsten silicon layer is modified by implanting nitrogen into the structure. |
申请公布号 |
US2016240478(A1) |
申请公布日期 |
2016.08.18 |
申请号 |
US201514623115 |
申请日期 |
2015.02.16 |
申请人 |
GLOBALFOUNDRIES INC. |
发明人 |
Ferrer Domingo A.;Kohli Kriteshwar K.;Krishnan Siddarth A.;Shepard, JR. Joseph F.;Wong Keith Kwong Hon |
分类号 |
H01L23/525;H01L27/112 |
主分类号 |
H01L23/525 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a semiconductor structure, the method comprising:
forming a tungsten silicon layer on an insulator, wherein the tungsten silicon layer comprises tungsten and silicon; introducing nitrogen into the tungsten silicon layer to form a nitrogen-containing tungsten silicon layer, wherein the nitrogen-containing silicon layer contains nitrogen, wherein a concentration of nitrogen in the nitrogen-containing silicon layer is at least 1 mole %; and forming a first conductive material and a second conductive material on the tungsten silicon layer, wherein the nitrogen-containing tungsten silicon layer forms an electrical connection between the first conductive material and the second conductive material. |
地址 |
Ugland House KY |