发明名称 レーザ加工装置、レーザ加工方法及びインクジェットヘッド基板
摘要 The surface of a material to be processed can be irradiated with a pulsed laser light at predetermined intervals while keeping a constant repetition frequency of a laser oscillator, and a high accuracy of laser processing is achieved. A laser processing apparatus (100) includes a control device(8) which controls switching of a blocking/transmitting of the pulsed laser light (2) in a laser irradiation control system (7). The control device (8) obtains, from a scanning speed of a pulsed laser light (2) on the surface of a material to be processed, an irradiation period of the pulsed laser light required to irradiate the surface of the material to be processed with the pulsed laser light (2) at predetermined intervals. Furthermore, the control device (8) controls the laser irradiation control system (7) so that the surface of the material to be processed is irradiated with the pulsed laser light in the obtained irradiation period.
申请公布号 JP5967913(B2) 申请公布日期 2016.08.10
申请号 JP20110268723 申请日期 2011.12.08
申请人 キヤノン株式会社 发明人 倉知 孝介
分类号 B23K26/06;B23K26/00;B23K26/082;H01S3/00 主分类号 B23K26/06
代理机构 代理人
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