发明名称 部品搭載方法及び部品搭載装置
摘要 PROBLEM TO BE SOLVED: To provide a component mounting method which allows for mounting of a component on a substrate while suppressing oxidation of the electrode, and the like.SOLUTION: The component mounting method includes a first step for exposing a substrate 20, on which components 22, 23 are arranged with a solder paste 24 containing solder powder interposed therebetween, to a reduction atmosphere and reducing and removing an oxide film, a second step for heating the substrate 20 to the melting point of solder powder or higher, a third step for exposing the substrate 20 to a radical atmosphere and removing a reductant by decomposing with the radical, and a fourth step for lowering the temperature of the substrate 20 below the melting point of solder powder.
申请公布号 JP5962123(B2) 申请公布日期 2016.08.03
申请号 JP20120072125 申请日期 2012.03.27
申请人 富士通株式会社 发明人 岡本 圭史郎;作山 誠樹
分类号 H05K3/34;B23K1/00;B23K1/008;B23K31/02;H01L21/60 主分类号 H05K3/34
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