| 摘要 |
The method of the invention relates to a method for welding a first (20) and a second (30) layers together. The second melting temperature of the second layer (30), Tm,2, is lower than the first melting temperature of the first layer (20), Tm,1. After having formed a layup (50) by placing the first layer (20) on top of the second layer (30), a rotating tool (70) is pressed and translated over at least a friction portion (15) of the upper surface (20u) of the first layer (20) such that the temperature reached by at least a portion of the upper surface (30u) of the second layer (30) is higher than the second melting temperature, Tm,2. Restraining means allow preventing molten second material from flowing out of the layup (50). Materials of first (20) and second (30) layers are chosen among the following materials: metals, semi-metals, or semiconductors. |
