发明名称 シリコンウエーハの加工方法
摘要 PROBLEM TO BE SOLVED: To provide a method for processing a plate-like object capable of removing grinding distortion of a plate-like object and forming a gettering layer having a gettering effect in a simple method.SOLUTION: A method for processing a plate-like object comprises the steps of: holding a plate-like object by a chuck table; pressing the plate-like object held by the chuck table by rotating a polishing pad containing an abrasive grain while rotating the chuck table holding the plate-like object and polishing the plate-like object with the polishing pad while supplying an alkaline or acid polishing liquid to the plate-like object and the polishing pad; and rotating the chuck table and the polishing pad and generating a gettering layer in the plate-like object by the polishing pad while supplying a rinse liquid to the plate-like object held by the chuck table and the polishing pad pressing the plate-like object after performing the polishing step.
申请公布号 JP5963537(B2) 申请公布日期 2016.08.03
申请号 JP20120117519 申请日期 2012.05.23
申请人 株式会社ディスコ 发明人 長澤 圭一;猿見田 誠
分类号 H01L21/304;H01L21/322 主分类号 H01L21/304
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