发明名称 CERAMIC SINTERED COMPACT, CIRCUIT BOARD USING THE SAME, ELECTRONIC DEVICE AND THERMOELECTRIC CONVERSION MODULE
摘要 [Problem] There are provided a ceramic sintered body with superior thermal conductivity as well as high rigidity, a circuit board that does not crack easily, a highly reliable electronic device and a highly reliable thermoelectric conversion module. [Solution] A ceramic sintered body with superior thermal conductivity as well as high rigidity may be obtained by having a main crystalline phase predominantly composed of silicon nitride, and a grain boundary phase predominantly composed of magnesium oxide and rare-earth oxide, the grain boundary phase containing a component which is expressed in compositional formula form as: REMgSi 2 O 5 N, where RE represents rare-earth metal. Furthermore, when the ceramic sintered body is used in a circuit board, the circuit board does not crack easily and a highly reliable circuit board may be formed. An electronic device and thermoelectric conversion module that use this circuit board may be made highly reliable.
申请公布号 EP2546216(B1) 申请公布日期 2016.08.03
申请号 EP20110753404 申请日期 2011.03.09
申请人 KYOCERA CORPORATION 发明人 ISHIMINE,YUUSAKU;MORIYAMA,MASAYUKI;KOMATSUBARA,KENJI;NAKAO,YUUYA
分类号 C04B35/584 主分类号 C04B35/584
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