METHOD FOR MANUFACTURING Sn ALLOY BUMP

摘要

Provided is a method for manufacturing an Sn alloy bump, wherein composition of the Sn alloy bump can be readily controlled. The method for manufacturing an Sn alloy bump formed of an alloy composed of Sn and other one or more types of metals has a step of forming an Sn layer (4a) on an electrode pad (3) in a resist opening (2a) formed on a substrate (1) by electrolytic plating; a step of laminating Sn and an alloy layer (4b) on the Sn layer (4a) by electrolytic plating; and a step of forming an Sn alloy bump (5) by melting the Sn layer (4a) and the laminated alloy layer (4b) after removal of a resist (2).