| 摘要 |
PROBLEM TO BE SOLVED: To enable measuring of a wafer thickness without being affected by splash or mist and enable loading and unloading of a wafer onto/from a holding table without increasing costs associated with a grinding device.SOLUTION: A grinding device 1 is configured such that a wafer W held by a holding plate 24 provided in holding means 2 which rotates around a rotation axis 20 and a lapping plate 4 approach and separate from each other. An air bag 23 is disposed between the rotation axis 20 and the holding plate 24, and a displacement gauge 33 for measuring displacement of the thickness of the wafer W is disposed inside the air bag 23. While the internal pressure of the air bag 23 which is reduced by thinning of the wafer W is maintained at a prescribed pressure by supplying air into the air bag 23, an amount of displacement of the holding plate 24 which is lowered in the direction of approaching the lapping plate 4 by thinning the wafer W is measured by the displacement gauge 33, and the amount of displacement of the holding plate 24 is recognized as the amount by which the wafer has been ground. |
