| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a power module, which can secure insulation at one end and the other end of a ceramic substrate even when a circuit layer is formed using copper or a copper alloy with deformation resistance, and provide a substrate for a power module having a heat sink using the substrate for a power module, and a manufacturing method for the substrate for a power module.SOLUTION: A substrate 10 for a power module comprises a circuit layer 12 on one surface of a ceramic substrate 11 and an electronic component 3 on one surface of the circuit layer 12. The circuit layer 12 is formed of copper or a copper alloy. Between the ceramic substrate 11 and the circuit layer 12 are provided a buffer aluminum layer 16 made of aluminum or an aluminum alloy bonded on the one surface of the ceramic substrate 11, and an auxiliary ceramic substrate 17 bonded on the other surface of the circuit layer 12. |
