发明名称 ガス支援レーザ・アブレーション
摘要 An improved method for laser processing that prevents material redeposition during laser ablation but allows material to be removed at a high rate. In a preferred embodiment, laser ablation is performed in a chamber (140, 501) filled with high pressure precursor (etchant) gas so that sample particles ejected during laser ablation will react with the precursor gas in the gas atmosphere of the sample chamber. When the ejected particles (108) collide with precursor gas particles (202), the precursor is dissociated, forming a reactive component that binds the ablated material. In turn, the reaction between the reactive dissociation by-product and the ablated material forms a new, volatile compound (204) that can be pumped away in a gaseous state rather than redepositing onto the sample (104).
申请公布号 JP5954923(B2) 申请公布日期 2016.07.20
申请号 JP20100178698 申请日期 2010.08.09
申请人 エフ・イ−・アイ・カンパニー 发明人 マーカス・ストロー;ミロス・トス
分类号 H01L21/302;B23K26/12;B23K26/16;B23K26/36 主分类号 H01L21/302
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