| 摘要 |
PROBLEM TO BE SOLVED: To prevent chip flying at a peripheral part of a work-piece.SOLUTION: An adhesive tape 1 comprises: an adhesive layer 20 to which a wafer as a work-piece is attached; and a base material film 10 for supporting the adhesive layer 20. The adhesive layer 20 includes a strong adhesive region 21 corresponding to a peripheral part of the wafer and an inner region 24 corresponding to a part where chips are to be formed from the wafer. When assuming that adhesion of the strong adhesive region 21 is (A) and adhesion of the inner region 24 is (B), the adhesions of each region meet conditions represented as the following formula (1-1): (A)>(B) (1-1). |
