| 摘要 |
The modules 6 comprise reinforcement 8applied in a non-desctructive manner, preferably via bonding. The reinforcement may include a bonding material and a reinforcement element bonded to the module The reinforcement may have a strip like shape. The reinforcement may be a laminate or composite. The reinforcement may also include a resin binder, ceramic binder or epoxy adhesive. There may be sensors to measure module deformation in use. Also claimed is a bridge with the module and a method of non-destructively reinforcing a mobile bridge module. |
