| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition being excellent in the edge shape, resolution and residual film ratio of a resist pattern, and a method for forming a resist pattern and a method of manufacturing a wiring board using the same .SOLUTION: Based on the total solid content of a photosensitive resin composition, the photosensitive resin composition contains (A) an alkali-soluble polymer: 10-90 mass%, (B) a compound having an ethylenically unsaturated bond: 5-70 mass%, and (C) a photopolymerization initiator: 0.01-20 mass%. The photosensitive resin composition comprises (B) the pentaerythritol based compound having an ethylenically unsaturated bond. |
