| 摘要 |
A substrate processing device to suppress contamination inside a transfer chamber, suppresses heat conduction from a processing chamber to a transfer chamber with a simple structure, and reduce cost is disclosed. The substrate processing device includes a process module maintained in a vacuum atmosphere to perform plasma process on a wafer, a transfer module maintained in a vacuum atmosphere to transfer the wafer into/out of the process module; and a coupling member connects the process module and the transfer module. The coupling member has a metal frame member interposed between a vacuum chamber of the process module and a transfer module housing part, and that separates the transfer module having a vacuum atmosphere and an exterior of the substrate processing device having an air atmosphere; and a plurality of spherical members that is in contact with an inner surface of the frame member inside the frame member. |
