发明名称 BUFF PROCESSING UNIT, AND SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To supply process liquid sufficiently at the interface of a substrate and a contact member with the substrate, in buff processing.SOLUTION: A buff processing unit performing buff processing of a substrate includes a buff table configured rotatably while supporting a substrate, a first buff head to which a first buff pad can be attached, and configured rotatably, and movably in a direction away from the buff table, with an inner supply line supplying process liquid for buff processing to the substrate being formed in the first buff head, and a second buff head to which a second buff pad can be attached, arranged to surround the first buff head on the outside thereof, and configured rotatably and movably in a direction approaching the buff table and a direction receding therefrom.SELECTED DRAWING: Figure 9
申请公布号 JP2016119333(A) 申请公布日期 2016.06.30
申请号 JP20140256473 申请日期 2014.12.18
申请人 EBARA CORP 发明人 YAMAGUCHI KUNIAKI;OBATA ITSUKI;MIZUNO TOSHIO
分类号 H01L21/304;B24B37/00;B24B37/04;B24D13/14 主分类号 H01L21/304
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