| 摘要 |
The present invention relates to technology regarding an alignment checking apparatus and a semiconductor integrated circuit apparatus including the same. The alignment checking apparatus includes: a center pad; an edge pad configured to enclose the center pad, and having a withdrawal route on at least one surface thereof; and a connection wire passing through the withdrawal route to electrically connect the center pad and an inner circuit. Since an additional contact process for detouring is not required, an electric defect which can be generated by the contact process can be reduced. |
