| 摘要 |
PROBLEM TO BE SOLVED: To provide a non-curable thermal expandable putty composition high in thermal expansion magnification and excellent in fire resistance (gap sealing performance), less likely to generate loosing shape after thermal expansion and excellent in persistence of the fire resistance, having light weight and excellent in transportability and further good in processability.SOLUTION: There is provided a non-curable thermal expandable putty composition containing a binder resin, a resin made micro balloon and an expandable graphite and having hardness of 50 N or less, specific gravity of 0.5 to 1.5 and thermal expansion magnification of 4 times or more.SELECTED DRAWING: None |
