CPU PACKAGE SUBSTRATE WITH REMOVABLE MEMORY MECHANICAL INTERFACE

摘要

PROBLEM TO BE SOLVED: To reconfigure the memory device arrangement after CPU package assembly.SOLUTION: A configurable central processing unit (CPU) package substrate is disclosed. A package substrate that includes a processing device interface is described. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.SELECTED DRAWING: Figure 2A