发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a technology which inhibits unintentional substrate processing from being conducted after predetermined substrate processing is completed.SOLUTION: A substrate processing apparatus includes: a substrate support part which supports a substrate in a processing chamber; a process gas supply part which supplies a process gas to the processing chamber; and a moving mechanism which moves the substrate support part between a first position, at which the process gas supplied from the process gas supply part is blown onto the substrate, and a second position, at which the process gas supplied from the process gas supply part is not blown onto the substrate, in the processing chamber.SELECTED DRAWING: Figure 1
申请公布号 JP2016119348(A) 申请公布日期 2016.06.30
申请号 JP20140256951 申请日期 2014.12.19
申请人 SUMITOMO CHEMICAL CO LTD 发明人 FUJIKURA HAJIME;KONNO TAICHIRO;NONAKA TAKEHIRO;NUMATA TAKAYUKI
分类号 H01L21/205;C23C16/44;C30B25/12 主分类号 H01L21/205
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