发明名称 |
DIFFUSION SOLDERING METHOD USING THE FORMATION OF A DIFFUSION ZONE AS A SOLDER CONNECTION, AND ELECTRONIC ASSEMBLY WITH SUCH A SOLDER CONNECTION |
摘要 |
A diffusion soldering method for joining an electronic component to a substrate is provided. The joining surfaces are designed such that cavities are formed in a joining gap between the component and substrate. The formation of such cavities can be provided, e.g., by depressions in a mounting surface of the component and/or in a contact surface of the substrate, the depressions being cup-shaped and/or defining channels that surround columnar structural elements, the end faces of which define the mounting surface and/or contact surface. The cavities are designed such that solder material can leak into the cavities when the component during a heating process to achieve a desired width of the joining gap. This allows for the formation of a narrow-width joining having a diffusion zone that bridges the joining gap upon soldering. In this manner, a diffusion solder connection can be produced even using standard solder. |
申请公布号 |
EP3036761(A2) |
申请公布日期 |
2016.06.29 |
申请号 |
EP20140771823 |
申请日期 |
2014.09.11 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
STROGIES, JÖRG;WILKE, KLAUS |
分类号 |
H01L21/60;H01L23/488 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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