| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper powder capable of easily forming a conductor film having preferable low temperature sinter ability and low resistivity, and a production method of the same.SOLUTION: The copper powder of the invention is configured so that: a primary particle has an average diameter D in a range of 0.10 or more and 0.6 μm or less, and an organic surface treatment agent is coated to the particle surface. In a state that the organic surface treatment agent is coated to the particle surface, a ratio of the organic surface treatment agent in the particle is equal to or more than 0.25 mass% and equal to or less than 5.50 mass% in carbon atom conversion. The copper powder can be produced by: mixing water, reaction liquid having mutual solubility with the water, including an organic solvent capable of reducing surface tension of the water as a liquid medium, and including univalent or bivalent copper source, and hydrazine; reducing the copper source for generating a copper particle; and treating the generated copper particle with the organic surface treatment agent. |
