POWER SEMICONDUCTOR MODULE

摘要

Disclosed is a power semiconductor module, comprising an outer shell upper cover (201) and an outer shell base (206) which are arranged oppositely, and an integral locating device (205) arranged between the outer shell upper cover (201) and the outer shell base (206), wherein the outer shell base (206) being provided with a plurality of locating bosses (207), the integral locating device (205) is provided with a plurality of locating grids (208), the number of the locating grids (208) is the same to that of the locating bosses (207), and locations of the locating grids (208) correspond to those of the locating bosses (207). In the power semiconductor module, the locating grids (208) on the integral locating device (205), and the locating bosses (207) are located in a matching mode, so that the case that each chip (203) is placed in a proper location can be guaranteed; accordingly, a machine can be used to place the chip (203) into the locating grid (208) automatically, thereby greatly increasing the production efficiency.