| 摘要 |
PROBLEM TO BE SOLVED: To easily perform equipotential bonding grounding on a plurality of panel devices in which a plurality of electric apparatuses are accommodated in a plurality of panel housings in a distributed manner.SOLUTION: In an electric facility system, inside of a plurality of panel housings, a predetermined number of electric apparatus accommodated in the panel housings are separately connected to a plurality of ground relay bases which are provided in accordance with ground types of the electric apparatuses. The plurality of ground relay bases provided in the panel housings and the panel housings are electrically connected. Outside of the panel housings, the ground relay bases of the panel devices or the panel housings are connected with each other via predetermined conductive members and at least one of the ground relay bases, the panel housings, or the conductive members is connected to a connection pole (ground pile) that is buried underground.SELECTED DRAWING: Figure 1 |
