| 发明名称 |
UV CURABLE CMP POLISHING PAD AND METHOD OF MANUFACTURE |
| 摘要 |
A method of fabricating a chemical mechanical polishing pad includes introducing polymer precursors containing acrylate functional groups into a mold, providing abrasive particles and a photo-initiator in the polymer precursors to form a mixture, and while the mixture is contained between a bottom plate and a top cover of the mold, exposing the mixture to ultraviolet radiation through a transparent section of the mold to cause the polymer precursors to form radicals, forming a polymer matrix from the polymer precursor by causing the radicals to cross-link with one another. The polishing layer includes the polymer matrix having the abrasive particles dispersed therein. |
| 申请公布号 |
US2016176021(A1) |
申请公布日期 |
2016.06.23 |
| 申请号 |
US201414575608 |
申请日期 |
2014.12.18 |
| 申请人 |
Applied Materials, Inc. |
发明人 |
Orilall Mahendra Christopher;Bajaj Rajeev;Redeker Fred C. |
| 分类号 |
B24D11/00;B24D3/32;B29C35/08 |
主分类号 |
B24D11/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of fabricating a chemical mechanical polishing pad, comprising:
introducing polymer precursors containing acrylate functional groups into a mold; providing abrasive particles and a photo-initiator in the polymer precursors to form a mixture; while the mixture is contained between a bottom plate and a top cover of the mold, exposing the mixture to ultraviolet radiation through a transparent section of the mold to cause the polymer precursors to form radicals, and forming a polymer matrix from the polymer precursor by causing the radicals to cross-link with one another, the polishing layer comprising the polymer matrix having the abrasive particles dispersed therein. |
| 地址 |
Santa Clara CA US |
