| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding wire capable of simultaneously satisfying ball bonding reliability required for a bonding wire for a memory and wedge bondability.SOLUTION: The bonding wire includes: a core material, containing one or more kinds of Ga, In, and Sn of 0.1 to 3.0 at.% in total, whose remaining part is composed of Ag and inevitable impurities; and a coating layer, formed on a surface of the core material, containing one or more kinds of Pd and Pt, or containing Ag and one or more kinds of Pd and Pt, whose remaining part is composed of inevitable impurities. The thickness of the coating layer is 0.005 to 0.070 μm.SELECTED DRAWING: None |
