EPOXY RESIN CONTAINING SILICONE-MODIFIED EPOXY RESIN AND POLYCARBOXYLIC ACID COMPOUND, AND CURED PRODUCT THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a silicone-modified epoxy resin composition which gives a cured product excellent in low gas permeability, mechanical strength, and heat-resistant transparency and gives an optical semiconductor sealing material excellent in heat cycle resistance, and to provide an epoxy resin cured product obtained by curing the composition.SOLUTION: The epoxy resin composition contains the following components (A)-(C): (A) a silicone-modified epoxy resin having a cyclic siloxane structure; (B) a silicone-modified epoxy resin having a branched siloxane structure; and (C) an epoxy resin curing agent containing a polycarboxylic acid having a tricyclodecane structure and a carboxylic acid anhydride compound.SELECTED DRAWING: None