发明名称 |
SUBMICRON SILVER PARTICLE INK COMPOSITIONS, PROCESS AND APPLICATIONS |
摘要 |
Provided herein are conductive ink compositions having a good balance between adhesion to substrate, stability of submicron-sized particles, the ability to be sintered at relatively low temperatures, and good electrical conductivity. In one aspect, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, such conductive networks are suitable for use in touch panel displays. In certain aspects, the invention relates to methods for adhering submicron silver particles to a non-metallic substrate. In certain aspects, the invention relates to methods for improving the adhesion of a submicron silver-filled composition to a non-metallic substrate. |
申请公布号 |
EP3033401(A1) |
申请公布日期 |
2016.06.22 |
申请号 |
EP20140836611 |
申请日期 |
2014.07.08 |
申请人 |
HENKEL IP & HOLDING GMBH;HENKEL AG & CO. KGAA |
发明人 |
XIA, BO;OLDENZIJL, RUDOLF W.;CHEN, JIANPING;DREEZEN, GUNTHER |
分类号 |
C09D11/52;C09D5/24;H01B1/00;H05K3/10 |
主分类号 |
C09D11/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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