发明名称 METHOD FOR PRODUCING A COVER FOR OPTICAL MEMS PACKAGING
摘要 A production methods includes providing a substrate including a lattice plane that extends in a non-symmetrical manner and such that it is offset at an angle α from at least a first or second main surface region of the substrate, the first and second main surface regions extending parallel to each other; anisotropic etching, starting from the first main surface region, into the substrate so as to obtain an etching structure which includes, in a plane extending perpendicularly to the first main surface region, two different etching angles relative to the first main surface region; arranging a cover layer on the first main surface region, so that the cover layer lies against the etching structure in at least some sections; and removing, section-by-section, the material of the substrate starting from the second main surface region in the area of the deformed cover layer, so that the cover layer is exposed in at least one window region.
申请公布号 EP2892844(B1) 申请公布日期 2016.06.22
申请号 EP20130771455 申请日期 2013.09.27
申请人 FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. 发明人 LANGA, SERGIU;DRABE, CHRISTIAN;SANDNER, THILO
分类号 G02B26/08;H01L21/3065 主分类号 G02B26/08
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