发明名称 METHOD OF FORMING A SEMICONDUCTOR DEVICE INCLUDING TRENCH TERMINATION AND TRENCH STRUCTURE THEREFOR
摘要 In an embodiment, a method of forming a semiconductor may include forming a plurality of active trenches and forming a termination trench substantially surrounding an outer periphery of the plurality of active trenches. The method may also include forming at least one active trench of the plurality of active trenches having corners linking trench ends to sides of active trenches wherein each active trench of the plurality of active trenches has a first profile along the first length and a second profile at or near the trench ends; and forming a termination trench substantially surrounding an outer periphery of the plurality of active trenches and having a second profile wherein one of the first profile or the second profile includes a non-linear shape.
申请公布号 US2016172234(A1) 申请公布日期 2016.06.16
申请号 US201615047874 申请日期 2016.02.19
申请人 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 发明人 GRIVNA Gordon M.;HOSSAIN Zia;SALIH Ali
分类号 H01L21/762;H01L29/06;H01L21/768 主分类号 H01L21/762
代理机构 代理人
主权项 1. (canceled)
地址 Phoenix AZ US