| 摘要 |
The present invention provides a conductive adhesive composition having excellent adhesiveness and low surface resistance and capable of being used as a buffer layer of an electronic device. The conductive adhesive composition according to the present invention includes (A) a water-soluble polyvinyl polymer, (B) an organic additive, and (C) a conductive organic polymer compound, wherein the organic additive (B) is at least one member selected from water-soluble polyhydric alcohols, water-soluble pyrrolidones, and hydrophilic aprotic solvents, and the conductive organic polymer compound (C) is at least one member selected from polyanilines, polypyrroles, polythiophenes, and derivatives thereof. In addition, the present invention provides an electronic device having a conductive layer composed of the foregoing conductive adhesive composition, a cathodic laminate having a conductive layer composed of the foregoing conductive adhesive composition laminated therein, and a method for manufacturing the same electronic device. |
