| 摘要 |
A semiconductor vacuum line heating device using a sheet type heating element is disclosed. A heating device for a semiconductor vacuum line which heats the semiconductor vacuum line, which is formed to deliver a vacuum pressure formed at a vacuum pump to a specific place, to a predetermined temperature comprises: an inert gas line which penetrates an inner wall of a vacuum pipe constituting the vacuum line and is formed such that inert gas circulates along a predetermined path; and a heater including a sheet type heating element which is installed on the inert gas line and heats the inert gas to a predetermined temperature. The sheet type heating element includes 3-6 parts by weight of carbon nanotube particles, 0.5-30 parts by weight of carbon nanoparticles, 10-30 parts by weight of a mixing binder, 29-83 parts by weight of an organic solvent, and 0.5-5 parts by weight of a dispersant, with respect to 100 parts by weight of a heat radiating paste composition. The mixing binder can include a heat radiating paste composition formed by mixing epoxy acrylate, polyvinyl acetal or a phenolic resin with one another, or mixing hexamethylene diisocyanate, polyvinyl acetal, and a phenolic resin with one another. According to the present invention, since a heat-resisting property of the semiconductor vacuum line heating device is improved, resistance variation with respect to temperatures is decreased. Furthermore, since a specific resistance is reduced, the heating device can be operated at a low voltage while consuming less power. |
