发明名称 スパッタリング装置および基板処理装置
摘要 A sputtering apparatus includes a chamber, a substrate holder, first to fourth target holders, a shutter unit, and a gate valve through which the substrate is conveyed. The first to fourth target holders are arranged on vertices of a virtual rectangle having long sides and short sides and inscribed in a virtual circle centered on the axis, the first target holder and the second target holder are respectively arranged on two vertices defining one short side of the virtual rectangle, and a distance to the gate valve is shorter than distances from the third target holder and the fourth target holder to the gate valve.
申请公布号 JP5933029(B2) 申请公布日期 2016.06.08
申请号 JP20140549761 申请日期 2013.08.23
申请人 キヤノンアネルバ株式会社 发明人 石原 繁紀;小長 和也;戸谷 寛行;須田 真太郎;安松 保志;藤本 雄;中澤 俊和;中村 英司;今井 慎
分类号 C23C14/34 主分类号 C23C14/34
代理机构 代理人
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