| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can efficiently cool an external connection electrode for connecting the semiconductor device and an external device.SOLUTION: A semiconductor device 1 comprises: a metal heat sink 6; a substrate 9 which is provided on the heat sink and on which a wiring pattern 8 is formed; a semiconductor element 2 mounted on the wiring pattern; and a plurality of conductive components electrically connected to the semiconductor element. The plurality of conductive components include external connection electrodes 2-4 which extend to the outside of the semiconductor device and any one of or each of a plurality of the external connection electrodes includes a heat transfer part 101 provided in contact with the heat sink via an electrical insulation material 102. |
