发明名称 Electronic Chip Card
摘要 The invention relates to an electronic chip card having a multilayer structure, comprising a system carrier (1), which comprises an electrically insulating substrate with interconnects (2) arranged thereon,cover layers (3, 4) arranged on the top and bottom of the system carrier,a biometric sensor (18), anda semiconductor component (19) that is designed to evaluate the signals from the biometric sensor (18) and to store biometric data, wherein the semiconductor component (19) is electrically conductively connected to one or more interconnects (2) of the system carrier (1). It is the object of the invention to provide an electronic chip card having a biometric sensor (18), which electronic chip card allows a relatively large number of electronic components to be accommodated on the system carrier (1) of the chip card. Furthermore, the electronic chip card is intended to be able to be produced as easily and inexpensively as possible and in relatively large numbers. This object is achieved by the invention by virtue of the semiconductor component (19) and the biometric sensor (18) being arranged in a common housing (22) that contains the semiconductor component (19) beneath the biometric sensor (18), wherein the semiconductor component (19) with the biometric sensor (18) forms a biometry module (11).
申请公布号 US2016155039(A1) 申请公布日期 2016.06.02
申请号 US201414905449 申请日期 2014.07.16
申请人 NEYMANN Peter-Joachim;MUHLHAUSE Christoph 发明人 NEYMANN Peter-Joachim;MUHLHAUSE Christoph
分类号 G06K19/07 主分类号 G06K19/07
代理机构 代理人
主权项 1. Electronic chip card having a multilayer structure, comprising: a system carrier, which comprises an electrically insulating substrate with interconnects arranged thereon, cover layers arranged on the top and bottom of the system carrier, a biometric sensor, and a semiconductor component that is designed to evaluate the signals from the biometric sensor and to store biometric data, wherein the semiconductor component is electrically conductively connected to one or more interconnects of the system carrier, wherein the semiconductor component and the biometric sensor are arranged one above the other, preferably in a common housing, wherein the semiconductor component is located beneath the biometric sensor, and wherein the semiconductor component with the biometric sensor forms a biometry module.
地址 Recklinghausen DE