| 摘要 |
PROBLEM TO BE SOLVED: To provide an RFID inlet antenna which features high adhesive strength with a cover material without using hot-melt adhesives, and thermal stability that prevents blocking even under high temperature environments.SOLUTION: An RFID inlet antenna has a circuit 101 made from a metal foil laminated on at least one surface of a resin film 103 with an adhesive layer 102 in between, and is characterized by the fact that; (1) the resin film 103 has a melting point of no less than 225°C, (2) the adhesive layer 102 contains both a vinyl acetate resin and a urethane resin, and (3) content A (mass%) of the vinyl acetate resin in the adhesive layer and content B (mass%) of the urethane resin therein satisfy conditions expressed as; 0.9≤(A/B)≤3.5, and 50≤(A+B).SELECTED DRAWING: Figure 1 |
